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IRS21851SPbF
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters
are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured under board
mounted and still air conditions.
Symbol
V C C
V IN
V B
V S
V HO
dV s /dt
P D
Rth JA
T J
T S
T L
Definition
Low-side supply voltage
Logic input voltage (HIN)
High-side floating well supply voltage
High-side floating well supply return voltage
Floating gate drive output voltage
Allowable V S offset supply transient relative to COM
Package power dissipation @ T A ≤ +25 °C
Thermal resistance, junction to ambient
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
Min.
-0.3
COM -0.3
-0.3
V B - 20
V S - 0.3
—
—
—
-55
-55
—
Max.
20 (Note 1)
V CC + 0.3
620 (Note 1)
V B + 0.3
V B + 0.3
50
1.25
100
150
150
300
Units
V
V/ns
W
°C/W
°C
Note 1: All supplies are fully tested at 25 V. An internal 20 V clamp exists for each supply.
Recommended Operating Conditions
For proper operation, the device should be used within the recommended conditions. All voltage parameters are absolute
voltages referenced to COM. The offset rating are tested with supplies of (V CC -COM)=(V B -V S )=15 V.
Symbol
V C C
V IN
V B
V S
V HO
T A
Definition
Low-side supply voltage
HIN input voltage
High-side floating well supply voltage
High-side floating well supply offset voltage
Floating gate drive output voltage
Ambient temperature
Min.
10
COM
V S + 10
Note 2
V S
-40
Max.
20
V C C
V S + 20
600
V B
125
Units
V
°C
Note 2: Logic operational for V S of -5 V to 600 V. Logic state held for V S of -5 V to -V BS . (Please refer to the Design
Tip DT97-3 for more details).
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